X-Ray Inspection

 

X-ray inspection is a non-destructive test. It is a process to verify the bond wire connections, die size comparison and ESD damaged. At Global Electronics Testing Services our typical sample lot check is 5 samples or 100% depending customer requirement. Counterfeit devices can be determined by comparing the structure of the die to a known good device. Part should be identical from bond wire location to die size. X-Ray perform base on AS5553 and MIL-STD-883 2012.7.

 


X-ray inspection is just one step in counterfeit avoidance. This test is considered a non-destructive test and can identify;

• Broken bond wires
• ESD and EOS detection
• Voids
• Die size
• Die shape
• Die bond options
• Misplaced bond wires
• Lead design
• Canted die
• Comparative analysis

Lead Design

Bonding Options

Bond Wires

Lead Design Bonding Options Bond Wires
     

Comparative

Damage

Die Size

Comparative Analysis ESD Damage Die Size