CCAP-101 Certification Program

This program describes the tests and inspections required that Certified Independent Distributors (ID) must use to detect and avoid delivery of counterfeit electronic components. When the Certified IDs do not have the capability to perform all of these tests. GETS has obtained Approval from some Certified IDs to perform the tests listed below. For more information Call GETS at 727-807-7991.

This is a standard procedure for the authentication of electronic components, integrated circuits, hybrid microcircuits, semiconductors, transistors, diodes, capacitors and resistors.


- Heated Solvent Test (HST) - detecting detection for coating and remarking
- X-Ray inspection to assure uniform internal construction
- XRF of leads or BGA for correct material
- De-capping of for die inspection
- Electrical Testing – Level A semiconductors only
- Electrical Testing - Passive components – Level A & B

4.10 When the ID elects to use ---------

General requirements

3.1 Test Labs (TL)
All testing performed to this document shall be located in the continental USA. The test labs contracted to
perform test and inspections specified herein are responsible for conformance to the requirements.

3.2 Warranty
Labs that perform testing to this document are responsible to the ID for completeness and accuracy of the
results. Shall be warranted for 1 year for the tests and inspections performed.

3.3 Quality system
The TL shall establish and maintain as a minimum a documented quality system conforms to ISO 9001 and
the additional requirements of this document.

3.4 Procedure control
The TL shall establish and maintain a system to control and distribute the procedures that implement the
requirements of this document and ISO 9001. A history of procedure changes, copies of processing records,
lot travelers, inspection records, including digital photos, and forms are maintained for a minimum of 5 years
after the last components in the lot are delivered.

3.5 Records

1) Written Records - All handwritten entries shall be in ink.

2) Incorrect Entry – The only acceptable error correction method for handwritten entries is to line out the
incorrect entry with a single line, add the new information, the date of correction and initial the new
entry. Any obliteration of data, use of correction fluid or tape, or erasers for corrections is not
permitted on any record including lot travelers, calibration records, or the Certificate of Conformance.

3) Record Retention and Retrievability - The ID shall document and maintain all records for at least five
(5) yesrs.

4) The inspection and tests performed for this Program shall be reported to the ID on suitable forms with
accuracy and detail to permit analysis by the ID’s internal quality, customer auditor, and Government

5) Samples of any counterfeit components detected shall be securely controlled and returned to the ID.

3.6 Electro-static discharge (ESD) - Safe handling procedure
The TL shall maintain a system for electro-static discharge sensitive (ESDS) components protection shall be
in compliance with the latest revision of ANSI/ESD S20.20-2007 by a competent organization with periodic
verification and test of ESD suppression and detection equipment.

3.7 Inspection, test status and traceability
The TL shall provide a means to identify inspection status of all components throughout inspection, handling,
processing, and storage. This may be accomplished through the use of inspection sheets, tags, routing cards
or other control devices that are attached to, or travel with, the product.

1) The method of indicating the person performing a function shall be controlled and allow for easy status
determination (e.g., stamps, signatures, electronic identification). A personnel list shall be kept current for
all stamps or initials and the log of status shall be available to the auditor for inspection and verification of
names upon request.

2) When operators or inspectors use signature or initials in lieu of stamps on processing records the
signature/initials must be on record, legible and traceable.

3.8 Calibration of equipment
The TL shall calibrate and maintain all inspection, measuring and testing equipment that is used for CCAP-
101 authentication in accordance with ANSI/NCSL Z540-1, whether owned or leased.

3.9 Training
The TL shall identify the training needs and provide for the training of all personnel in the proper handling of
components and performing the authentication & counterfeit detection procedures required for this Program.
Employees shall be retested and/or retrained a minimum of once per year, when procedural changes occur,
or when personnel performance indicates poor proficiency resulting in the shipment of components found to
be counterfeit by a customer.

3.10 ID location
The TL shall perform all tests and inspections for this program at the locations identified and shall be in the
USA. TL approval is not available to off-shore operations.

4.0 Detail requirements

4.1 Digital photography
Digital cameras, including handheld digital cameras suitable for low-magnification photos, used in conjunction
with microscopes shall have a resolution of 1.3 megapixel (Mpx) minimum, but 3 Mpx or more is desirable for
image capture. Digital photos shall be made on a minimum of 3 samples at appropriate magnification and
shall be a true representation of the characteristics observed:
- Indications of blacktopping, overcoating or remarking.
- Lead conditions indicative of reclaim or previous use.
- Uniform lighting, no overexposure, shadows or washout of features.
Die photos
- Full frame of die, sharply focused and square orientation.
- To illustrate major functional blocks or metallization pattern and markings such as date, logo, mask
numbers, alignment keys, etc, referenced to a low-power “location” photo of the entire die.
- Uniform lighting across the die or field of view.
Once the image is captured, it may be rotated, cropped, reformatted, darkened or lightened, etc., to enhance
the image. Without altering the fundamental information contained. Images incorporated into electronic
reports should avoid excessive file size, as they expand the document size to the point that they are
cumbersome and cannot be sent via email. Image capture should be Joint Picture Expert Group (JPEG)
formatting. Images shall be cropped to reduce file size due to extraneous background content. All images
shall be provided to the customers in JPEG.

(This test is to verify the OCM’s marking permanency, but may not identify when the markings are counterfeit, as it will
not remove cured epoxy paints or special clear overcoats)

4.2 Blacktopping and overcoat of semiconductor detection
PEMs components shall be tested by scrape test of the component surface with a new, sharp blade (like
Xacto) to detect if blacktopping or a coating has been applied to the body of component to inhibit the acetone
test. Any peeling or flaking of the material indicates coatings that were not soluble in acetone and have been
remarked. The acetone resistant coatings can be tested with aggressive solvents heated per the
manufacturers' directions. The top half showing date code shall be protected with Kapton tape from the
solvent liquid/fumes. The unprotected half shall be inserted in solvent in vertical position using a metal holder
such that the heated solvent reaches to the tape. The solvent shall be preheated in a beaker using a hot plate
under a vented hood until simmering and the part inserted for adequate time to dissolve the coating. The
component shall be removed and solvent extracted with water or alcohol. Inspect the part for signs of
overcoating, old markings and sanding marks. Any component whose markings are removed or disturbed by
these tests shall result in rejection of the complete population that the component represents. This is a
destructive test and the component shall be identified separately for return to the ID. This test requires
extensive safety practices and should only be performed by a qualified lab.

4.2.1 Plastic ball grid and pin grid arrays (PBGA)
Coatings are being used that will withstand acetone and many of the traditional strippers. PBGAs shall be
tested in an epoxy solvent heated to the boiling temperature (per supplier data sheet) for 15 to 25 minutes as
appropriate. This test can be very dangerous and must be performed under vented hood with full safety
equipment (goggles, gloves, etc.) in accordance with solvent manufacturers instructions. Kapton tape shall be
used to cover half of the markings including the date code and only the uncovered section immersed standing
up in the solvent for the selected time. Do not allow chemical to cover the kapton tape. Photographs shall be
made before and after the test to clearly show the results.

4.2.2 Photographs
Laser markings shall be smooth and consistent and show no signs of burned package or holes and match the
OCMs typical markings. Counterfeiters have become very proficient in remarking parts with laser. The
previous markings have to be removed or covered before laser marking can be applied. This is the reason
extensive effort must be made to determine if the components have a coating applied. Attempts must be
made to determine if the OCM was using laser markings for the date code shown on the part. Extra
investigation must be made to view the original surface of the package to detect removal of previous
markings using the heated solvent technique.

4.3 X-ray inspection
X-ray inspection shall be performed on all of the visual inspection samples, (100% up to 50 pcs/1000) prior to
selecting decap samples when: 1) does the package contain a die, 2) are the die same size, 3) consistent
internal construction 4) correct wire bonds. X-ray inspection and imaging should be used to determine the
exact die location within the package, so as to avoid cutting of internal wires when decapping the component.
Components exhibiting construction differences detected by x-ray shall be decapped to identify that the die
are all exactly alike, if not the inspection lot shall be rejected as counterfeit.
The value of X-ray is increased when there is a known good OCM device available for comparison of internal details.

4.4 XRF testing of leads
The lead material and plating shall be tested in accordance with paragraph 4.8 herein.

4.5 Decapping
Decapping shall be performed on a minimum of three (3) samples that appear abnormal and/or randomly
from X-ray for each lot/sub-lot. For orders containing 20 components or fewer, only one (1) suspect sample or
randomly selected is required to be decapped. Chemical decapping shall not be performed by immersing the
entire PEM package in acid but though selective etching.
Decapping of semiconductor devices is performed to allow high magnification photomicrographs for inspection of the
internal die for authenticity to the OCM named on the external package. The entire die, along with its markings and
manufacturer’s logo shall be photographed.

4.6 Die inspection (Integrated circuits and semiconductor components)
The ID shall have specialized equipment and personnel especially trained in their decapsulation.
Hermetically sealed components should be decapped by mechanical method of cutting or shearing open
package, glass diodes are excluded. Decapping of plastic encapsulated semiconductors shall be performed by chemical techniques. Precaution must be taken to prevent damage of the die or interconnection wires.
Samples shall be decapped and examined for:
a) Correct OCM die for the marked part number. Even when the correct OCM name or logo is marked
on the die, additional research is required to assure it is the correct die for the part number marked.
Some may contain no markings at all.
b) Numbers on legitimate OCM IC die may not be the same as the external part number.
c) Logos on legitimate OCM die may not be those of the manufacturer marked on the package, due to
cross-licensing and patent expiration. Without proof of these facts by the OCM, the components must
be rejected as counterfeit. There may be a significant time difference between the date on the
package and the date on the die, as the same die mark could have been used for many years.
d) Ink dots on the die that indicate, it was rejected by the OCM.
e) Condition of the bonding wires
f) Correct wire material (Al, Au, Cu, other)
g) Determination that the markings on the die match the OCM markings for the component type marked
on the package.
h) Indication of electrical overstress such as fused metal, ruptured oxide, excessive heat, etc.
i) Indications of corrosion due to moisture or other contaminants entering the package.

4.6.1 Photo records shall be made with enough detail to clearly reveal the characteristics being inspected
by use of: 1) digital photomicrographs of the die including the wire bonds to chip pads and package leads; 2)
Higher magnification photos that clearly show any markings and name or logo on the die.

4.7 Passive components
Passive components physical characteristics vary considerably by the type of component. Various methods
are required to verify authenticity and use of a competent outside lab is recommended:
a) X-ray of electrolytic capacitors and comparison to known authentic components.
b) Test electrically as specified in 4.9.6.
c) Check dimensions to data sheet.
d) Does packaging match OCM typical.

4.8 XRF and solderability testing
In addition, one lead from each component shall have base metal and plating tested for conformance to the
materials identified by the OCM markings. BGAs and Pin Grid array packages are excluded from solderability
as no standard procedures for this test are available. The balls and pins shall be XRF tested for correct
plating content.
It may be necessary to verify if a legitimate change in lead plating material was made by the OCM.

4.8.1 Solderability
The semiconductors samples used for decapsulation shall have a minimum of two leads from each sample
tested for solderability in accordance with J-STD-002 or MIL-STD-883, TM 2003 as applicable. Leads tested
for solderability shall exhibit a continuous solder coating free from defects for a minimum of 95% of the critical
area of the individual lead. For exposed pad packages, the exposed pads surfaces shall exhibit a continuous
solder coating free from defects for a minimum of 80% of the critical area of those surfaces. Anomalies other
than de-wetting, non-wetting and pin holes are not cause for rejection. Rejection of one of the samples shall
result in the lot being rejected. JPEG images shall be captured of all three (3) samples, after this test pass or

4.8.2 XRF testing
XRF testing shall be performed before solderability testing. Two leads from each of the decap components
shall be tested to ensure that the components elements match the OCM specifications. Two balls minimum
from one BGA shall be tested for correct materials. The results shall verify that the component leads contain
the correct metals. Failure of one or more of the leads requires customer approval for acceptance for the
components respresented by the sample or shall result in the lot being rejected.

4.9 Electrical testing, required for Level A verification (discretes and integrated circuits)
Electrical testing is a key procedure in determining that components are authentic to an OCM’s component,
however, it may not assure that the components are new or not refurbished. The operator must be trained
and knowledgeable in electrical testing. Some basic electrical testing may be performed by the ID on certain
component types using handheld or bench top testers. This testing can determine whether the components
internal bond wires are connected or shorted before performing more expensive testing. The testing of more
complex components will have to be performed by an experienced test house with suitable test equipment.
The ID shall specify the tests to the test lab, which shall be based upon the generic types of tests specified
below for the different components. These tests shall be identified/marked by the ID on the OCM data sheet
or military detail specification for the test contractor.

4.9.1 Electrical test samples for semiconductors
For lot sizes of 30 components or less, all (100%) of the devices shall be tested as defined herein. For
homogenous lots larger than 30 components, the ID shall randomly select 30 test samples per 1000 pieces
and tested from each lot/sub-lot. A catastrophic failure (open, short, other) in one or more of the test sample
shall be cause to reject the entire population. In the case of failure of one or more samples for minor
parameter limits, the whole lot can be 100% tested to salvage the compliant components. This only applies
when none of the previous inspections and tests indicate components are suspect counterfeit. The specified
tests shall be performed to the OCM’s data sheet for commercial devices and the Military detail specification
for military part numbers. The customer may specify larger quantities to be tested.
The electrical test samples shall be maintained separately from the remainder of the lot.

4.9.2 Parametric
Parametric testing, pin opens and shorts, DC and AC can determine whether the device is grossly defective
or not authentic to the component ordered. Comparative bench testers can test basic electric parameters if a
known-good-authentic device for the type under test is available.
(Improper parametric testing can damage otherwise good and authentic devices. When a curve tracer is used, the
operator shall be fully trained on the equipment and semiconductor device operation.)

4.9.3 Functional testing
Functional testing is not required for CCAP-101 Level A components, however, the customer may specify
such testing when required for their applications. This testing can be difficult to perform but valuable in
component authentication to the OCM component data sheet, it is typically expensive and in many cases
OCM functional test software is not available.

4.9.4 Integrated circuits
Integrated circuits shall be electrically tested to the extent necessary to assure authenticity of the test
samples to the markings. Specific parameters shall be specified by the ID or approved test lab and identified
to the OCM applicable data sheet or military specification. Examples of minimum parametrics to be tested are
listed below:
Digital logic:
DC parameters, 25 0C and min/max temperature
Other tests useful to verify authenticity
Linear, Op Amps & Mixed logic
Full power & voltage conditions
DC parameters, 25 0C and min/max temp
AC parameters 25 0C
Microprocessors, DSPs, Microcomputers & similar
Key DC parameters at 25 0C and min/max temperatures
Memories, RAM, SRAM, FPGA, etc.
Input and output pins, open and short
DC parameters at min/max temperature
FPGAs are unprogramed
Write and read to memory and speed, for RAM and FPGA
Other applicable tests
Other Type Devices
Similar parameter verification based upon datasheet

4.9.5 Discrete semiconductors
Specific tests to be performed shall be marked on the OCM data sheet or military specification as applicable
to the component by the ID or approved test lab. The following minimum tests are guidelines for electrical
Hfe, (gain) 25 0C and max temp. at medium and min/max current
hfe, and leakage currents
IEBO, ICBO, at rated voltage
Vce (sat) at rated current
VF Forward voltage drop at rated current
IR Reverse leakage current at rated voltage
VZ Knee voltage
IR Leakage current
SCRs, thyrisitors
Holdoff voltage
Peak trigger current
Leakage current

4.9.6 Passive components
All passive components (both Level A & B) not contained in OCM verified packaging shall be sample tested,
50 pcs/1000 components for parameters specified below.
Most passives can be tested with electronic bridges, and curve tracers.
Capacitance and tolerance at 25 0C and min/max temp
Leakage current
ESR (Electrolytics only)
Inductance over or within specified frequency and temperature range
Series resistance
Resistance and tolerance at 25 0C and min/max temp.
Temperature coefficient
Other Passives
Applicable parameters

4.9.7 Electrical Test Data recording
The organization performing the electrical testing shall record the parameter conditions and limits used for
acceptance of the components. The data from these tests will be recorded for all parameters that have a
minimum or maximum limit on the datasheet. This data shall be included with the CCAP-101 inspection report
to customers.

4.10 Test Labs Responsibility
When the elects to use outside test labs for x-ray, decapsulation, XRF of lead material verification die
authentication, solderability or electrical characteristics, the ID is still fully responsible for the results and
actions taken from this testing. Only test labs approved by CTI to Appendix 7 are acceptable to perform this
testing with equipment suitable and personnel trained for the test and inspections they will perform. The test
lab contractor shall not change, alter or modify these test requirements and shall provide specific data
(photos, narrative description of the findings), read and record electrical test data that verifies the status of the
components. The Approved Test Labs shall complete Form 1 of A7, Certification of Performance.

4.10.1 Audit
CTI reserves the right to audit each contractor to verify their training, equipment and procedures suitable for
the contracted work. When the tested components and data are returned, the ID shall thoroughly inspect the
photos and test results to assure conformance to the requirements, the same as if performed in house. ID
should keep the number of Approved Labs used to no more than two (2) or three (3) for each type of testing

4.11 Additional testing
The ID test lab may be requested to perform additional value added testing and analysis that shall be carried
out under controlled conditions after the components authenticity is established, including the following:
1) Documented work instructions defining the operations, handling, package/container opening, ESD,
name of the approved lab that was utilized, etc.
2) For packaged products the marking process shall not obliterate or alter the OCM’s marking;
3) Customer specified component programming and electrical tests shall be documented in procedures
covering the master units and shall include program revisions/changes as required.
4) Components which have extra testing, screening or programming performed on them in accordance
with a specific customer order shall not be restocked with, or supplied as, OCM virgin product.
5) Value-added processing (e.g., environmental screening tests) performed by the ID’s contract test labs
shall conform to the same quality system requirements contained herein.

4.12 Documentation and inspection records
The TL shall record all inspection results on a forms similar to the A1 – A4 forms of CCAP-101 for the
samples from each lot or sub-lot that is inspected. The records shall identity:
1. OCM’s name marked on the part
2. Date code and lot number, if marked
3. Name of country marked
4. HST Test results and photographs
5. X ray results and copy of images
6. XRF results
7. Decap findings and photos of all markings on the die and metal pattern
8. Electrical test results, Level A semiconductors and both level A&B passives.
9. Status of components inspection result to ID: accepted ___rejected
10. Names of persons performing the inspections and date
11. A-7 Form 1

4.12.1 Submission to customer
A printed or electronic copy of the CCAP-101 inspections results as selected by the ID, including digital
photos and Certificate of Compliance for the order shall be supplied to the customer with the shipment.

4.12.2 Retention
A complete copy of the report and data package shall be maintained by the ID for a minimum of five (5) years
for both commercial and military components.

This program for Certification of Independent Distributors to avoid counterfeit components, for more information contact CTI, Component Technology Institute, Inc.

Are you interested in becoming CCAP-101 Certified?

Follow this link

Components Technology Institute Inc.

2608 Artie St. Suite 4

Huntsville, AL 35805

Tel +1-256-536-1304 Fax +1-256-539-8477

E mail:

CCAP 101 Testing, CCAP certified, CCAP101, CCAP-101, counterfeit detection, test, screening, compliant, CTI, Component Technology Institute, GETS, gets usa, global electronics testing services. A standard procedure for the authentication of electronic components, integrated circuits, hybrid microcircuits, semiconductors, transistors, diodes, capacitors and resistors. Call GETS at 727-807-7991