External Visual Inspection


External visual inspection is a process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality.  Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.



Visual Inspection is a term used for inspecting electronic components under a microscope to determine if a device has been altered from its original state. During this process a device may show signs of non conformance or inconsistencies that help determine if a device has been used or if a device is new and original. This process is normally performed by a Components Test Lab or Test House for short. This process is a non-destructive and devices can be used afterwards. There are so many things to look for during a visual inspection. Here are some things generally looked for during a visual inspection of IC Devices:

Device Markings

Pin Indicator

Body Inspection

Inconsistently Printed Device Markings
• Double Printed Markings
• Marking Placement
Ghost Markings
• Faded Device Markings
• Marking Alignment
• Font Consistently Printed
• Illegible Markings
Marking Orientation
• No Markings
• Laser Burns

• Texture of Pin Indicator
• Consistent Orientation
• Foreign Material Inside Pin
• Coating Inside Pin
• Overspray Inside Pin
• Fibers from Cleaning Inside Pin
• Country of Origin
• Pin Size
• Pin Depth

Sanding Marks
• Secondary Coating
• Pull Marks
• Tool Marks
• Flaking
• Scratches
• Molding Texture
• Foreign or Displaced Material
• Contamination
• Mold Mark
• Mold Flash
• Corrosion
• Cracks
• Chips
• Overspray
• Inconsistent Textures
• Voids


BGA Condition

Package Condition

Substrate Damage
Foreign or Displaced Material
Residue on Substrate
Substrate Scratches

• Ball Formation
• Scratches on BGA
• Residue BGA
Smashed or Flattened BGA
Missing BGA or Ball Grid Array
• Excess Solder Material
• Foreign Material on BGA
• Scratched Substrate Thru BGA

• Physical Dimensions
• Package Construction
• Construction Defects



Lead Condition


• Oxidation
• Re-Tinned
• Straightened
• Refurbished
• Bent Leads
• Tool Marks
• Lead Plating Quality
• Lead Alignment
• Lead Formation
• Lead Coplanarity
• Exposed Copper

• Scratches on Leads
• Scoring
• Voids
• Plating Composition
• Physical Dimensions
• Residue
• Distorted
• Corrosion
• Chips in Leads
• Excess Solder Material
• Exposure to High Temperatures