External Visual Inspection


External visual inspection is a process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality.  Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.



Visual Inspection is a term used for inspecting electronic components under a microscope to determine if a device has been altered from its original state. During this process a device may show signs of non conformance or inconsistencies that help determine if a device has been used or if a device is new and original. This process is normally performed by a Components Test Lab or Test House for short. This process is a non-destructive and devices can be used afterwards. There are so many things to look for during a visual inspection. Here are some things generally looked for during a visual inspection of IC Devices:

Device Markings

Pin Indicator - COO

Body Inspection

Inconsistently Printed Device Markings
Double Printed Markings
Marking Placement
Ghost Markings
Marking Alignment
Font Inconsistently Printed
Marking Splatter
Marking Orientation
Laser Burns

Texture of Pin Indicator
Position of Pin Indicator Comparison
Foreign Object Debris Inside Pin
Secondary Coating Inside Pin Indicator
Different Country of Origin
Pin Size and Depth Comparison

Sanding Marks
• Secondary Coating
• Pull Marks
• Tool Marks
• Flaking
• Scratches
• Molding Texture
• Foreign or Displaced Material
• Contamination
• Mold Mark
• Mold Flash
• Corrosion
• Cracks
• Chips
• Overspray
• Inconsistent Textures
• Voids

Solder Mask

BGA Condition

Package Condition

Solder Mask Damage
Foreign or Displaced Material
Residue on Soldermask
Soldermask Scratches

• Ball Formation
• Scratches on BGA
• Residue BGA
Smashed or Flattened BGA
Missing BGA or Ball Grid Array
• Excess Solder Material
• Foreign Material on BGA
• Scratched Substrate Thru BGA

• Physical Dimensions
• Package Construction
• Construction Defects



Lead Condition


• Oxidation
• Re-Tinned
• Straightened
• Refurbished
• Bent Leads
• Tool Marks
• Lead Plating Quality
• Lead Alignment
• Lead Formation
• Lead Coplanarity
• Exposed Copper

• Scratches on Leads
• Scoring
• Voids
• Plating Composition
• Physical Dimensions
• Residue
• Distorted
• Corrosion
• Chips in Leads
• Excess Solder Material
• Exposure to High Temperatures