Baking and Dry-Pack
Many devices are moisture sensitive with improper packaging which can cause major issues for the end-user. Moisture-induced interface delamination begins with the package absorbing moisture from the environment, which condenses in micropores in polymer materials such as the substrate, die-attach and molding compound. During the PCB assembly process, when the part is exposed to high temperatures associated with the soldering process, popcorning may occur. We can eliminate these problems by baking and dry-pack all moisture-sensitive devices prior to leaving our facility. All process is based on J-STD-033B-1.