Pinpointing the root cause of a component board level failure can be very difficult since there are many variables including environmental factors, type of application, service life and pertinent design information and storage and handling. At Global ETS we have developed a process that will not only confirm if your component is defective but also the root cause of the failure. While identifying the root causes and associated responsibilities of any failure are the primary goals, the added value is prevention of future occurrences.
Our Failure Analysis Capabilities Include:
Die Bump Short
Scanning Electron Microscopy(SEM) analysis