Counterfeit Screening and Detection

Counterfeit IC devices are being found in helicopters, weapons, submarines, planes, and many other military applications. When these devices fail under a mission critical time. It could be the difference between life and death for our military personnel.

By having your parts tested and inspected by third party test laboratory, you are doing your due diligence. Before the sale of any components or IC devices, it is important to have them tested to ensure a devices authenticity. At Global Electronics Testing Services, LLC. we specialize in component verification.

Next time you sell or order parts, have them tested with us.

High Definition External Visual Inspection is a process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality. Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 on a sample of parts from a given lot.

Decapsulation is chemically etching a device until the die is exposed. This is done with a Jet Etch system from Nisene Technology Group. Once the die is exposed, a device may be confirmed by reading the internal die markings under a microscope. In some events a die marking will correlate with a devices external markings.

  • Confirms secondary coating
  • Exposes bead blasting marks
  • Exposes sanding marks
  • Shows previous markings
  • Dissolves partially cured resins
  • Exposes pull marks and chips

XRF can be carried out on parts to evaluate the material composition of the terminations and the molding compound in order to detect the presence or absence of Pb and other discrepancies with an authentic part. This is a non-destructive test. A complete graph will be providing with a list of substances found.

X-ray inspection is a non-destructive test. It is a process to verify the bond wire connections, die size comparison and ESD damaged. Our typical sample lot check is 5 samples or 100% depending customer requirement. Counterfeit devices can be determined by comparing the structure of the die to a known good device. Part should be identical from bond wire location to die size.

  • Digital, Linear, Memory, and MPU
  • Linear IC, Op Amps, and Mixed Logic
  • Microprocessors, DSPs, Microcomputers
  • Memories, RAM, FPGA, ROM
  • Transistor, Diode, Zener, SCR or Triac
  • Passives capacitors, Resistor, Inductors