Component Re-Balling Services | Global ETS

Electronic Component
Re-Balling Services

The ZQ3500 provides fully automated reballing services for BGA components.

Traditional Method

Traditionally, BGA reballing relies on a manual approach, utilizing microscopes and precision tools to carefully de-tin, clean, and re-tin components. This work requires significant skill from the operator, leaving room for inconsistencies and defects that can impact component reliability.
A Global ETS technician wearing blue gloves using tweezers to perform re-tinning on an electronic component using a solder pot.

New Method

Our BGA reballing machine provides an end-to-end solution for the reballing workflow. This system is capable of executing the entire process, from tin removal to final inspection, and can accommodate most BGA components (0.3mm – 0.76mm). By automating this process, the reballing of components can be performed with unparalleled speed, precision, and consistency. The ZQ3500 enables users to perform BGA rework operations faster, cheaper, and more precisely than ever before.
Close-up of Global ETS’ automated semiconductor re-tinning machine, surrounded by various equipment and cables.
Industrial robot teach pendant displaying a 3D simulation of GETS’ automated semiconductor re-tinning machine and its position coordinates with a blue and white checkered background.

Tin Removal & Cleaning

The ZQ3500’s multi-functional tin removal system combines preheating, non-contact suction, hot air heating, and high-temperature scraping to remove solder balls and residue from BGA components. This is followed by a high-speed polishing and cleaning process to prepare the surface.
Industrial robot teach pendant displaying a 3D simulation of GETS’ automated semiconductor re-tinning machine and its position coordinates with a blue and white checkered background.

Flux Application & Reballing

Following cleaning, our machine can automatically print flux onto the BGA or apply it via a high-speed spot dispenser, depending on the component type. It then precisely aligns and attaches the new solder balls, ensuring consistent quality.
Industrial robot teach pendant displaying a 3D simulation of GETS’ automated semiconductor re-tinning machine and its position coordinates with a blue and white checkered background.

Inspection & Sorting

Integrated with CCD positioning and AOI detection systems, the ZQ3500 will perform comprehensive inspections, identifying any defects that may be present. Having these systems also allows the machine to sort the BGAs, ensuring only fully reworked and functional components are passed.
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