Semiconductor Testing Services | Global ETS

Semiconductor Testing Services

Testing ServicesAdvanced Services

Incoming Inspection

Incoming Inspection

The incoming inspection is performed upon receiving parts. This process is crucial, as it involves the documentation of what was received in. Verifying part numbers, purchase orders, and part count are performed during this inspection.
3D rendered image of a rolling cart with a computer monitor, keyboard, and mouse, to show incoming parts inspection.

External Visual Inspection

External Visual Inspection

The detailed visual inspection is a thorough examination of parts, using 40x magnification. This process can detect discrepancies with the devices against the testing standard, as well as customer requirements.
3D digital illustration of a white robotic assembly line with a conveyor belt and multiple mechanical parts, to illustrate visual inspection of semiconductors.

X-Ray / XRF

X-Ray / XRF

XRF Testing: XRF (X-ray Fluorescence) is a non-destructive test used on electronic parts to analyze their material composition.
A gray and white illustration of an industrial machine with a conveyor belt, screen, and reel for electronic components.

Electrical Testing

Electrical Testing

Passive component testing involves a comprehensive array of methods and measurements designed for the assessment and characterization of passive electronic components, including resistors, capacitors, and inductors. These components, in contrast to their active counterparts, do not amplify or switch electronic signals. This underscores the critical importance of utilizing highly accurate testing equipment.
Gray 3D rendering of a desk with a computer, robotic arm, and component testing machines attached.

Chemical & Destructive Test

Chemical & Destructive Test

The chemical & destructive tests are used to verify the attributes of a component and ensure they meet required standards.
3D rendering of a desk with three component testing machines attached as well as a computer monitor.

Shipping

Shipping

As the final step in the authentication process, it is crucial for ensuring the traceability and protection of components. Many components tested here at GETS are used in critical industries, including the defense and medical sectors.
Gray 3D image of a chair in front of a desk with a computer monitor and electronic testing machine attached.

Tape & Reel

Tape & Reel

The Tape & Reel process is a standard process when dealing with electronic components, and involves preparing and packaging parts for later use.
3D rendered image of 2 electronic testing machines connected by a conveyer belt, with one machine having one red and one blue light.

Baking

Baking

Baking after testing is typically done to eliminate any residual moisture that may have been absorbed during the testing process. This helps ensure the reliability and performance of the electronic components, especially in moisture-sensitive applications where even small amounts of moisture can have adverse effects.
Rectangular shaped 3D image of an industrial machine with a screen built into it.

Material Analysis

Material Analysis

Material analysis tests are necessary to evaluate composition, structure, and properties of part materials. Equipped with the newest tchnologies, GETS is able to complete an array of advanced material analysis tests.
3D image of a desk with a computer monitor, mouse, keyboard, and a material analysis machine on top for components.

Re-Tinning

Re-Tinning

The tinning procedure is used for a variety of purposes, such as the refurbishing of “Legacy Components”, tin whisker mitigation, and conversion of SN/Pb components to RoHS and vice versa.
3D image of an in-line automated re-tinning machine for electronic components.

Re-Balling

Re-Balling

Re-balling is used to replace the solder balls on a specific component, typically BGA’s (Ball Grid Array). When the existing solder balls on a component are damaged or degraded, replacing them on parts that would otherwise be discarded saves cost and reduces electronic waste in the industry.
Digital 3D rendering of an industrial machine with a computer monitor, a conveyor belt, and two green lights on top of the machine for re-balling components.

Programing Services

Programing Services

Our programming service offers electronics manufacturers the opportunity to subcontract the programming of their components. This alleviates the intricacies and extensive time commitments associated with programming during testing, leading to increased production line efficiency and cost-effectiveness.
3D laptop on a stand connected to a rectangular shaped machine that has one blue light and one red light on the top, connected by wires.

Die Level Testing

Die Level Testing

Die level testing means examination of individual semiconductor dies to verify that they meet required specifications and standards. The goal is to identify and address issues at the die level to prevent them from affecting the overall performance and reliability of the final electronic components or systems.
3D render of a monitor, keyboard, and mouse on a stand that is next to a rectangular semiconductor authentication machine.

Firmware Security Analysis

Firmware Security Analysis

Firmware security analysis encompasses many different solutions, but the main focus is to ensure the security of software embedded within electronic devices. Potential vulnerabilities, exploits, and weaknesses may be found while conducting analysis.
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Other

Other

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Digital image of an industrial component testing machine with wires hanging down and one red and one blue light on top.
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