Decapsulation

Internal Die Verification

Decapsulation Process Explained

Decapsulation is a process used to expose the internal structure of an integrated circuit. The de-cap process is completed using a mixture of 2% fuming Nitric acid and 20% fuming Sulfuric acid heated to a certain temperature. This mixture is then forced into a small hole in a gasket to etch away polymer encapsulants or exterior of a device using a Nisene Technologies Jetetch Pro Decapsulation machine. This creates a cavity in the device, exposing bonding wires, internal structure, and the die.
There are many terms used for this process in electronic components industry. Some of the terms used are Decapsulation, Decap, De-Lid, Expose Die, Internal Die Verification, and Internal Inspection. When the manufacture logo and markings are found. Markings are then compared to G.E.T.S. internal database of known good parts. Sometimes the die numbers and markings can be confirmed with the devices external markings.

Below is an example of the decapsulation process:

Here are examples before the decapsulation.

The top view of A40MX04-F device
The bottom view of A40MX04-F device
The top view of T8105BAL4 device
The bottom view of T8105BAL4 device

The device is put inside a Nisene Jetetch Pro machine to chemically etch a small cavity inside the device to expose die.

Global_ETS-103
Global_ETS-104
150735

After the die is exposed, the device is put under a microscope to see if the Manufacturer’s logo and any markings are visible. When the manufacture logo and markings are found. Markings are then compared to G.E.T.S. internal database of known good parts. Sometimes the die numbers and markings can be confirmed with the device’s external markings. Here are a few more examples of devices that have been decapsulated:

Die topography

Die marking