WETTING BALANCE TESTING SERVICES
Global ETS offers the most accurate solderability testing via Wetting Balance Testing, utilizing our Multicore Universal Solderability Tester (MUST) System 3. It is a high precision solderability tester for both surface mount (SMT) and leaded (through-hole) components, as well as PCB pads and plated through-holes (PTHs or bias) on bare boards. Capable of measuring down to 0.001mN with testing ability down to 0201 devices.
What are the differences between Dip and Look Method and Wetting Balance Analysis?
The Dip and Look Method:
Widely utilized in process QA and reliability monitoring.
It’s a qualitative test process – judgement on whether a sample passes or fails is based on the physical and visual attributes.
What are the differences between Dip and Look Method and Wetting Balance Analysis?
Wetting Balance Analysis:
A quantitative test that measures the wetting forces imposed by the molten solder on the test surface asit is dipped into and held in the
solder bath as a function of time and plotted.
The plot starts with the wetting force being negative (non-wet condition), which rises until it crosses the zero axis of wetting force, indicatingthatwetting has occurred.
The time it takes for wetting to occur is one parameterused to assesssolderability.
Wettability is influenced by the type of metal or contaminantson the surface.
It is often used in testing for counterfeit parts, as resurfaced leads will react differently than new parts.
Compliances:
IEC 60068-2-69 [-20/-54/-57 Rev]
MIL-STD-883 Method 2022
IPC/EIA J-STD-003A
IPC/EIA/JEDEC J-STD-002B
EIA/JET-7401
IEC 60068-2-20 and 60068-2-58
IPC/EIA/JEDEC J-STD-002B
IPC/EIA J-STD-003
