Baking and Dry-Packing

Many devices are moisture sensitive with improper packaging this can cause major issue at the end user. Moisture induced interface delamination begins with the package absorbing moisture form the environment, which condenses in micropores in polymer materials such as the substrate, die attach and molding compound. During PCB assembly process, when the part is exposed to high temperatures associated with the soldering process, popcorning may occur. We can eliminate these problems by baking and dry-pack of all moisture sensitive devices prior to leaving our facility. All process is based on J-STD-033B-1.

Dry-Packing or Dry pack of semicomponents Moisture sensitive devices are baked in an oven