Electronic Component Lead Tinning Services

We offered quick turn time tinning services for all type of components packages including Through-hole, SMT, LCCs, SOs, PLCCs, QFNs, DFNs, SOICs and QFPs.

Convert RoHS components to Tin-Lead for High-Reliability applications or Convert Sn/Pb components to RoHS.
A complete test report will be provided with completed tinned leads photos for each order.  XRF testing will be performing to verify tin composition.

New Automated Hi-Rel Lead Tinning

- Remove Gold Plating
- Refurbish Legacy Components
- Replace RoHS finish with Sn/Pb
- Mitigate Tin Whiskers
- Replace Sn/Pb finish with ROHS
- BGA Cleaning


LTS300 Hi Rel Retinning machine

The LTS300 is the newest addition to our Lead-Tinning family of automated equipment and will do it all with automation and robotic control. By using a two solder pot technology, you can remove the old finish on your components in the first solder pot along with all the contamination that makes the components difficult to solder, then put on a new finish with the solder of your choice that matches your manufacturing processes.

A pallet holder accepts a wide variety of component-specific pallets for ease of change-over, optimum control, and reduced cost. If you have specific components that you don’t see a fixture to fit it, we can design and make custom fixtures. The change-over from vacuum pick to pallet processing takes less than 30 seconds. This is an extremely versatile system that will re-tin nearly all through-hole and surface mount components.

Your components will be processed in accordance with: IPC/EIA J-STD-002 and ANSI-GEIA-STD-0006.  Contact our sales team for any additional information.

Convert RoHS components to Tin-Lead

Convert Sn/Pb components to RoHS

Your components will be processed in accordance with: IPC/EIA J-STD-002 and ANSI-GEIA-STD-0006


We also have manual lead tinning stations that will perform daily solder tests