High Precision Wetting Balance Solderability Testing

Global ETS offers the most accurate solderability testing via Wetting Balance Testing. Using our Multicore Universal Solderability Tester (MUST) System 3. It is a high precision solderability tester for both surface mount (SMT) and leaded (through-hole) components, as well as PCB pads and plated through-holes (PTHs or vias) on bare boards. Capable of measuring down to 0.001mN with testing ability down to 0201 devices.

What are the differences between Dip and Look Method and Wetting Balance Analysis?

The Dip and Look Method, which is widely used in process QA and reliability monitoring, is a qualitative test process, i.e., judgment on whether a sample passes or fails the test is based on the physical and visual attributes that it exhibits.

Wetting Balance Analysis, on the other hand, is a quantitative test, i.e., it measures the wetting forces imposed by the molten solder on the test surface as it is dipped into and held in the solder bath as a function of time and plotted. The plot starts with the wetting force being negative (non-wet condition), which rises until it crosses the zero axis of wetting force, indicating that wetting has occurred. The time it takes for wetting to occur is one parameter used to assess solderability. The wettability is influenced by type of metal or contaminants on the surface. It is often used in testing for counterfeit parts, as resurfaced leads will react differently than new parts. Want to learn more please contact our sales team.


  • IEC 60068-2-69 [-20/-54/-57 Rev]

  • MIL-STD-883 Method 2022

  • IPC/EIA J-STD-003A


  • EIA /JET-7401

  • IEC 60068-2-20 and 60068-2-58


  • IPC/EIA J-STD-003

High Precision Wetting Balance Solderability Testing